SENECA, PA – Matric Group, a contract manufacturer and engineering designer of board-level and box build electronic assemblies and industrial controls, held a ribbon-cutting ceremony today recognizing the investment in its new, state-of-the-art Surface-Mount Technology line.
According to the company, the new line maximizes flexibility while keeping ahead of the miniaturization of electronic designs. The investment was made possible, in part, by a $697,000 loan from the Pennsylvania Industrial Development Authority (PIDA) revolving loan fund.
Consisting of 13 new machines, the line is capable of placing smaller parts, doing so with lightning-quick speed and enhanced precision and accuracy. It will extend Matric’s component size range from .25 x .125mm microchips up to 120x90mm components. The new line also enhances package-on-package capability to allow for extremely high complex designs to be effectively assembled.
See exclusive photos from the ribbon-cutting ceremony at https://www.flickr.com/photos/manp/albums/72157692157850595